14th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2014, pp.83 - 86
Abstract
Si wafer was mechanically machined at nano scale based on quantitative determination of the ductile/brittle-machining transition point in this study. It was possible to determine the transition point by investigating the abnormal decrease of the cutting force. The machined patterns had sharp V-shapes, which pattern is hard to machine using lithography technology; the patterns had no brittle fractures nor any burrs.