dc.citation.conferencePlace |
CT |
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dc.citation.conferencePlace |
Dubrovnik |
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dc.citation.endPage |
86 |
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dc.citation.startPage |
83 |
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dc.citation.title |
14th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2014 |
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dc.contributor.author |
Jeon, EC |
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dc.contributor.author |
Kang, NR |
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dc.contributor.author |
Lee, KM |
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dc.contributor.author |
Cha, JH |
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dc.contributor.author |
Kim, JY |
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dc.contributor.author |
Lee, YH |
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dc.contributor.author |
Je, TJ |
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dc.contributor.author |
Choi, DS |
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dc.date.accessioned |
2023-12-20T00:06:13Z |
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dc.date.available |
2023-12-20T00:06:13Z |
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dc.date.created |
2019-03-25 |
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dc.date.issued |
2014-06-02 |
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dc.description.abstract |
Si wafer was mechanically machined at nano scale based on quantitative determination of the ductile/brittle-machining transition point in this study. It was possible to determine the transition point by investigating the abnormal decrease of the cutting force. The machined patterns had sharp V-shapes, which pattern is hard to machine using lithography technology; the patterns had no brittle fractures nor any burrs. |
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dc.identifier.bibliographicCitation |
14th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2014, pp.83 - 86 |
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dc.identifier.issn |
0000-0000 |
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dc.identifier.scopusid |
2-s2.0-84923126021 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/35002 |
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dc.language |
영어 |
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dc.publisher |
euspen |
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dc.title |
Mechanical nano machining of Si wafer by quantitative determination of ductile/brittle-machining transition point |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2014-06-02 |
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