Extremely Superhydrophobic Surfaces with Micro- and Nanostructures Fabricated by Copper Catalytic Etching
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- Extremely Superhydrophobic Surfaces with Micro- and Nanostructures Fabricated by Copper Catalytic Etching
- Lee, Jung-Pil; Choi, Sinho; Park, Soojin
- Catalytic etching; Chemical-etching process; Chemically modified; Cu nanoparticles; Electroless Cu plating; Etching condition; Hydrophobic properties; Low surface energy; Micro and nanostructures; Silicon surfaces; SIMPLE method; Super-hydrophobic surfaces; Superhydrophobic behavior; Thin layers; Water contact angle
- Issue Date
- AMER CHEMICAL SOC
- LANGMUIR, v.27, no.2, pp.809 - 814
- We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93 degrees to 149 degrees. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180 degrees.
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