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Ki, Hyungson
Laser Processing & Multiphysics Systems Laboratory
Research Interests
  • Laser materials processing
  • Laser material interaction

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펨토초 레이저를 이용한 실리콘 웨이퍼 드릴링의 공정 최적화 연구

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Title
펨토초 레이저를 이용한 실리콘 웨이퍼 드릴링의 공정 최적화 연구
Other Titles
Process optimization for femtosecond laser hole drilling of silicon wafer
Author
김형원기형선
Issue Date
2019-06
Publisher
대한용접접합학회
Citation
대한용접접합학회지, v.37, no.3, pp.220 - 225
Abstract
Laser trepanning drilling of 200 μm-diameter through-holes in 300 μm thick silicon wafer was investigated using a 1028 nm femtosecond laser. Emphasis was placed on the optimization of hole shape using process parameters, such as pulse overlap ratio, pulse-to-pulse time interval, beam polarization, and focal position. This study showed that a low pulse overlap ratio (10%) with a moderate scan number decreases the difference between the top and bottom aperture diameters. Furthermore, a large pulse-to-pulse time interval was found to reduce the thermal effect. A circularly-polarized beam that was focused at the bottom wafer surface produced hole apertures that were closest to circles.
URI
https://scholarworks.unist.ac.kr/handle/201301/27022
URL
http://e-jwj.org/journal/view.php?number=2032023
DOI
10.5781/JWJ.2019.37.3.4
ISSN
2466-2232
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