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고속 입출력 인터페이스 패키징의 최적 설계

Author(s)
한기진
Issued Date
2016-03
URI
https://scholarworks.unist.ac.kr/handle/201301/20700
Fulltext
http://www.dbpia.co.kr/Journal/ArticleDetail/NODE06669083
Citation
전자파기술, v.27, no.2, pp.22 - 31
Publisher
한국전자파학회
ISSN
1738-9712

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