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Kim, Gun-Ho
SoftHeat Lab.
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High thermal conductivity in amorphous polymer blends by engineered interchain interactions

Author(s)
Kim, Gun-HoLee, DongwookShanker, ApoorvShao, LeiKwon, Min SangGidley, DavidKim, JinsangPipe, Kevin
Issued Date
2015-03
DOI
10.1038/nmat4141
URI
https://scholarworks.unist.ac.kr/handle/201301/19201
Fulltext
http://www.nature.com/nmat/journal/v14/n3/full/nmat4141.html
Citation
NATURE MATERIALS, v.14, no.3, pp.295 - 300
Abstract
Thermal conductivity is an important property for polymers, as it often affects product reliability (for example, electronics packaging), functionality (for example, thermal interface materials) and/or manufacturing cost. However, polymer thermal conductivities primarily fall within a relatively narrow range (0.1-0.5 W m-1 K-1) and are largely unexplored. Here, we show that a blend of two polymers with high miscibility and appropriately chosen linker structure can yield a dense and homogeneously distributed thermal network. A sharp increase in cross-plane thermal conductivity is observed under these conditions, reaching over 1.5 W m-1 K-1 in typical spin-cast polymer blend films of nanoscale thickness, which is approximately an order of magnitude larger than that of other amorphous polymers.
Publisher
Nature Publishing Group
ISSN
1476-1122
Keyword
GLASS-TRANSITIONMODULUSFILMS

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