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Park, Lee Soon
School of Materials Science and Engineering
Research Interests
  • Flexible OLED new materials, process and fabrication
  • Touch Screen Panel(TSP) new materials and process new materials and process
  • Nano-materials synthesis and application (Ag nano-wire and metal mesh electrode)

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Studies on Designed Latex and Emulsion Polymerization : 3. 2-Stage Semicontinuous Emulsifier-Free Emulsion Polymerization for High Solid Content and Improved Latex Stability

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Title
Studies on Designed Latex and Emulsion Polymerization : 3. 2-Stage Semicontinuous Emulsifier-Free Emulsion Polymerization for High Solid Content and Improved Latex Stability
Author
Park, Lee SoonJang, Jin KyuPark, Sang Wook
Issue Date
1991-02
Publisher
POLYMER SOC KOREA
Citation
POLYMER-KOREA, v.15, no.6, pp.632 - 640
Abstract
Sodium itaconate(NaIA)를 이온성 공단량체로 하여 styrene을 2단계 무유화제 유화중합법으로 중합함으로서 전체 고형분을 30%까지 증가시켜도 안정된 무유화제 유화중합 반응 및 라텍스를 얻을 수 있었다. 2단계 무유화제 유화중합 반응에서 안정성에 영향을 미치는 인자들로는 일단계(seed) 라텍스의 고형분, 일단계 단량체(NaIA/styrene)의 무게비, 및 2단계 주입점임을 알 수 있었고 styrene/NaIA계에 있어서 이들이 각각 5%, 0.004, 및 95%에서 최적 조건이 관찰되었다. Sodium itaconate(NaIA) 단량체는 큰 chain transfer constant 및 steric hindrance로 인해 surface active한 oligoradical을 효과적으로 생성시키며 중합초기에 임계 미셀 농도(CMC)와 유사한 계면장력 곡선을 나타내었다. Emulsifier-free emulsion polymerization of styrene were carried out with a small amount of sodium itaconate(NaIA) as ionic comonomer. Employing seeded emulsion polymerization technique in this emulsifier-free emulsion polymerization, it was possible to increase total solid content of upto 30% with good stability of resulting latices. It was found that factors affecting the stability of this emulsifier-free emulsion polymerization method were NaIA/styrene weight ratio in the seed stage, proportions of solid contents in the seed and second stage reaction, and conversion of seed stage to initiate feeding of second stage monomers feed point. The optimum conditions for these factors were NaIA/styrene wt. ratio of 0.004, 5%/25% allocation of solid content, and feed point conversion of 95%.
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ISSN
0379-153X
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