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Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse File

Kim, Jinwoo , Murali, Gauthaman , Park, Heechun , Qin, Eric , Kwon, Hyoukjun , Chekuri, Venkata Chaitanya Krishna , Rahman, Nael Mizanur , Dasari, Nihar , Singh, Arvind , Lee, Minah , et al

Article Issue Date2020-11 View109
Being extraordinary: How CEOS' uncommon names explain strategic distinctiveness File

Kang, Yungu , Zhu, David H. , Zhang, Yan Anthea

Article Issue Date2021-02 View86
TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC File

Nguyen, Hung Viet , Ryu, Myunghwan , Kim, Youngmin

Article Issue Date2012-12 View118
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