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Showing results 1 to 6 of 6

200-mm Si CMOS Process-Compatible Integrated Passive Device Stack for Millimeter-Wave Monolithic 3-D Integration File

Park, Minsik , Song, Jonghyun , Jeong, Jaeyong , Lim, Jeong-Taek , Song, Jae-Hyeok , Lee, Won-Chul , Sim, Gapseop , Cho, Huijae , Yoo, Dongeun , Kang, Minho , et al

Article Issue Date2023-10 View0
Effects of Back Metal on the DC and RF Characteristics of 3D Stacked InGaAs RF Device for Monolithic 3D RF Applications File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Kim, Sanghyeon

Article Issue Date2023-04 View1
Heterogeneous and Monolithic 3D Integrated Full-Color Micro-Light-Emitting Diodes via CMOS-Compatible Oxide Bonding for μLEDoS File File

Kim, Hyun soo , Park, Juhyuk , Baek, Woo Jin , Geum, Dae-Myeong , Kim, Inki , Lim, Hyeongrak , Lim, Jinha , Kim, Seong Kwang , Jeong, Jaeyong , Shim, Joonsup , et al

Article Issue Date2025-08 View0
Heterogeneous and Monolithic 3D Integration of III-V-Based Radio Frequency Devices on Si CMOS Circuits File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Kim, Duckhyun , Jo, Eunju , Jeong, Hakcheon , Park, Juyeong , Jang, Jae-Hyung , Choi, Shinhyun , et al

Article Issue Date2022-06 View4
Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs File File

Jeong, Jaeyong , Geum, Dae-Myeong , Kim, SangHyeon

Article Issue Date2022-10 View5
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion File

Jeong, Jaeyong , Kim, Seong Kwang , Suh, Yoon-Je , Shim, Joonsup , Beak, Woo Jin , Choi, Sung Joon , Kim, Joon Pyo , Kim, Bong Ho , Geum, Dae-Myeong , Kim, Jongmin , et al

Article Issue Date2024-08 View0
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