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Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network File

Kim, Seungwon , Kim, Youngmin

Article Issue Date2017-09 View77
High-temperature adaptive through-silicon via with pyrolyzed carbon via-sealing plates for packaging 3D carbon nanostructure-based devices fabricated using C-MEMS File

Kwak, Jong-Hyun , Cho, Wootaek , Kim, Beomsang , Kim, Taesung , Shin, Heungjoo

Article Issue Date2024-01 View128
Interfacial Adhesion Energy of Ru-AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru-AlO Thin Film File

Kim, Jeong-Kyu , Cheon, Tae-Hoon , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2012-05 View69
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