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Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu File

Han, Seung-Min , Nandi, Dip K. , Joo, Yong-Hwan , Shigetomi, Toshiyuki , Suzuki, Kazuharu , Nabeya, Shunichi , Harada, Ryosuke , Kim, Soo-Hyun

Article Issue Date2020-05 View3
Atomic-layer-deposited WNxCy thin films as diffusion barrier for copper metallization File

Kim, Soo-Hyun , Oh, Su Suk , Kim, Ki Bum , Kang, Dae-Hwan , Li, Wei-Min , Haukka, Suvi , Tuominen, Marko

Article Issue Date2003-06 View8
Characterization of atomic layer deposited WNxCy thin film as a diffusion barrier for copper metallization File

Kim, Soo-Hyun , Oh, SS , Kim, HM , Kang, DH , Kim, KB , Li, WM , Haukka, S , Tuominen, M

Article Issue Date2004-03 View7
Large-Area Uniform 1-nm-Level Amorphous Carbon Layers from 3D Conformal Polymer Brushes. A "Next-Generation" Cu Diffusion Barrier? File

Kang, Yun-Ho , Lee, Sangbong , Choi, Youngwoo , Seong, Won Kyung , Han, Kyu Hyo , Kim, Jang Hwan , Kim, Hyun-Mi , Hong, Seungbum , Lee, Sun Hwa , Ruoff, Rodney S. , et al

Article Issue Date2022-04 View10
Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties File

Im, Byoungyong , Mun, Kiyeung , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-03 View7
TaCx Thin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization File

Hong, Tae Eun , Kim, Tae-Ho , Jung, Jae-Hun , Kim, Soo-Hyun , Kim, Hoon

Article Issue Date2014-01 View4
The formation of a dielectric SiNxCy sealing layer using an atomic layer deposition technique File

Kim, Doyoung , Kim, Soo-Hyun , Kim, Hyungjun

Article Issue Date2015-01 View3
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