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Analysis of Crack Parameters and Electrical Property in Flexible Devices Under Bending State File

Kim, Dong-Hyeon , Kwak, Ji-Youn , Kim, Ju-Young , Jeon, Eun-chae

Article Issue Date2025-09 View24
Enhanced heat dissipation performance of chemical-doped graphene for flexible devices File

Chung, Yung-Bin , Kireev, Dmitry , Kim, Myungsoo , Akinwande, Deji , Kwon, Sung-Joo

Article Issue Date2021-01 View154
Origami-structured Actuating Modules for Upper Limb Support File

Seo, Seongmin , Park, Wookeun , Lee, Dongman , Bae, Joonbum

Article Issue Date2021-07 View149
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