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Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network File

Kim, Seungwon , Kim, Youngmin

Article Issue Date2017-09 View79
Novel adaptive power-gating strategy and tapered TSV structure in multilayer 3D IC File

Kim, Seung Won , Kang, Seokhyeong , Han, Ki Jin , Kim, Youngmin

Article Issue Date2016-07 View201
TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC File

Nguyen, Hung Viet , Ryu, Myunghwan , Kim, Youngmin

Article Issue Date2012-12 View118
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