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Adhesion of poly(4,4 '-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin File

Yu, J , Ree, M , Shin, Tae Joo , Park, YH , Cai, W , Zhou, D , Lee, KW

Article Issue Date2000-03 View30
FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne File

Yu, Jinshu , Zhou, D , Cai, W , Park, SH , Shin, Tae Joo , Oh, W , Lee, SW , Ree, M

Article Issue Date2001-04 View46
Miscibility behavior of polyimide (PI)/poly(arylene ether benzimidazole) (PAEBI) blends and its effects on the adhesion of PI/PAEBI/copper joints File

Yu, J , Ree, M , Shin, Tae Joo , Wang, X , Cai, W , Zhou, D , Lee, KW

Article Issue Date2000-01 View63
Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: Effect of precursor origin File

Yu, J , Ree, M , Shin, TJ , Wang, X , Cai, W , Zhou, D , Lee, KW

Article Issue Date1999-10 View24
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