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Shin, Tae Joo
Synchrotron Radiation Research Lab.
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FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne

Author(s)
Yu, JinshuZhou, DCai, WPark, SHShin, Tae JooOh, WLee, SWRee, M
Issued Date
2001-04
DOI
10.1080/10587250108024760
URI
https://scholarworks.unist.ac.kr/handle/201301/16644
Fulltext
http://www.tandfonline.com/doi/abs/10.1080/10587250108024760#.VekIMyXtlBc
Citation
MOLECULAR CRYSTALS AND LIQUID CRYSTALS, v.371, pp.359 - 364
Abstract
For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4'-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis
Publisher
TAYLOR & FRANCIS LTD
ISSN
1542-1406

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