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Reliability analysis of polymer-based copper redistribution layers (RDL) in advanced packaging technologies

Kwak. Ji-Youn , Cherry, Emmanuel , Bertheau, Julien , Slabbekoorn, John , Messemaeker, Joke De , Beyne, Eric , Kim, Ju-Young

Conference Paper Issue Date2024-11-07 View33
Reliability Investigations of Polymer Based Redistribution Layers(RDL)

Kwak. Ji-Youn , Chery, Emmanuel , Slabbekoorn, John , Bertheau, Julien , Messemaeker, Joke De , Jeon, Eun-chae , Kim, Ju-Young

Conference Paper Issue Date2023-10-26 View66
반도체 패키징 구리 재배선층의 신뢰성 평가

Kwak, J.-Y , Chery, Emmanuel , Bertheau, Julien , Slabbekoorn, John , Messemaeker, Joke De , Beyne, Eric , Kim, Ju-Young

Conference Paper Issue Date2023-11-30 View92
산소 및 수분에 의한 폴리머 기반 구리 재배선의 신뢰성 평가

곽지윤 , Chery, Emmanuel , Slabbekoorn, John , Bertheau, Julien , Messemaeker, Joke De , Kim, Ju-Young

Conference Paper Issue Date2023-04-27 View77
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