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Hybrid Bonding of Cu Bumps and Insulating Polymers in Semiconductor Devices

Sim, Youngju , Kim, Hangeul , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2022-11-07 View131
Low-Temperature Cu Bump-Insulating Polymer Hybrid Bonding for Semiconductor 3D IC Packaging Application

Sim, Youngju , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2023-10-26 View70
Low-temperature hybrid bonding with photosensitive polymer insulation for advanced packaging

Sim, Youngju , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2024-11-07 View66
Nanomechanical Insights into Enhancing Flexibility and Reliability in Deformable Optoelectronic Devices File

Jeon, Hansol , Yoo, Hyeonji , Lee, So-Hyeon , Sim, Youngju , Kim, Su-Min , Kwak, Ji-Youn , Kim, Younghoon , Kim, Dong-Hyeon , Jo, Ji-Hyeon , Jeon, Jiheon , et al

Article Issue Date2025-07 View108
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