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Improved Properties of Atomic Layer Deposited Ru Films by Providing Additional Reactant for Cu Alternative Nanoscale Interconnects File

Kim, Jeongha , Mohapatra, Debananda , Son, Yeseul , Jang, Jae Min , Kim, Sang Bok , Cheon, Taehoon , Shong, Boggeun , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-04 View17
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