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Ambient air-operated thermo-switchable adhesion of N-isopropylacrylamide-incorporated pressure sensitive adhesives File

Hwang, Jeonguk , Lim, Daegyun , Lee, Geonwoo , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, KeumHwan , Ku, Kang Hee , Lee, Dong Woog

Article Issue Date2023-06 View66

Carboxyethyl acrylate incorporated optically clear adhesives with outstanding adhesion strength and immediate strain recoverability for stretchable electronics File

Lim, Daegyun , Baek, Myung-Jin , Kim, Hak Sun , Baig, Chunggi , Lee, Dong Woog

Article Issue Date2022-06 View42

Development of acrylate-based elastic pressure sensitive adhesives via photopolymerization File File

Lim, Daegyun

Thesis Issue Date2022-08 View25

Development of elastic pressure sensitive adhesives for flexible electronics

Lim, Daegyun , Baek, Myung-Jin , Kim, Hak Sun , Lee, Dong Woog

Conference Paper Issue Date2021-04-23 View19

Development of optical clear and pressure sensitive adhesives : exceptional adhesion strength and immediate strain recoverability for stretchable display

Baek, Myung-Jin , Lim, Daegyun , Lee, Dong Woog

Conference Paper Issue Date2022-03-31 View13

Incorporating H6XDI-PEG Diacrylate Crosslinker for Fast Strain Recovery and High Adhesion in Pressure Sensitive Adhesives for Flexible Displays

Park, Hyunok , Lim, Daegyun , Baek, Myung-Jin , Lee, Dong Woog

Conference Paper Issue Date2023-05-11 View15

Innovative NIPAM-Based PSAs for Carbon-Neutral Electronic Waste Management

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2024-10-18 View11

N-isopropyl acrylamide based thermo-responsive pressure-sensitive adhesive for eco-friendly waste management

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-05-11 View22

Pressure sensitive adhesive for flexible display with high adhesion and fast recovery by introducing flexible crosslinker H6XDI-PEG diacrylate

Park, Hyunok , Lim, Daegyun , Baek, Myung-Jin , Lee, Dong Woog

Conference Paper Issue Date2022-11-17 View12

Replacing Traditional Adhesives with Thermo-Switchable Adhesive for Eco-Friendly Recycling

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-10-12 View21

Stretchable pressure sensitive adhesives with high adhesive performance and optically clearance for flexible electronics

Lim, Daegyun , Baek, Myung-Jin , Kim, Hak Sun , Baig, Chunggi , Lee, Dong Woog

Conference Paper Issue Date2021-11-05 View15

Tailoring Pressure Sensitive Adhesives with H6XDI-PEG Diacrylate for Strong Adhesive Strength and Rapid Strain Recovery File

Park, Hyunok , Lim, Daegyun , Lee, Geonwoo , Baek, Myung-Jin , Lee, Dong Woog

Article Issue Date2023-11 View48

Temperature-Responsive Adhesives Based on N-isopropyl acrylamide

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-11-09 View21

Temperature-Responsive Adhesives for Sustainable Electronics Disassembly

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak-Sun , Park, Keum Hwan , Lee, Dong Woog

Conference Paper Issue Date2024-04-04 View6

Understanding the Role of a Water-Soluble Catechol-Functionalized Binder for Silicon Anodes by Diverse In Situ Analyses File

Ko, Sangho , Baek, Myung-Jin , Wi, Tae-Ung , Kim, Juyoung , Park, Changhyun , Lim, Daegyun , Yeom, Su Jeong , Bayramova, Khayala , Lim, Hyeong Yong , Kwak, Sang Kyu , et al

Article Issue Date2022-04 View30

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