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A Parametric Study on Interfacial Bond Strength in Cu/SiCN Hybrid Bonding: A Multiscale Approach File

Jang, Minki

Thesis Issue Date2025-08 View46
Structural characterization and bonding energy analysis for plasma-activated bonding of SiCN films: A reactive molecular dynamics study File

Kim, Juheon , Jang, Minki , Choi, Won Hong , Park, Junhyeok , Kim, Byungjo , Kim, Sunghyup , Chung, Hayoung

Article Issue Date2026-07 View19
이산요소법 기반의 고체전산모사를 위한 입자접합모델

Moon, Jeseung , Jang, Minki , Chung, Hayoung

Conference Paper Issue Date2023-11-02 View76
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