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A 3-DIMENSIONAL HIGH-THROUGHPUT ARCHITECTURE USING THROUGH-WAFER OPTICAL INTERCONNECT File

WILLS, D. Scott , Lacy, W. Stephen , Camperi-Ginestet, Christophe , Buchanan, Brent , Cat, Huy H. , Wilkinson, Scott , Lee, Myunghee , Jokerst, Nan Marie , Brooke, Martin A.

Article Issue Date1995-06 View79
Silicon VLSI processing architectures incorporating integrated optoelectronic devices File

Lee, Myunghee , Cat, Huy H. , Buchanan, Brent , Wills, D. Scott , Brooke, Martin , Jokerst, Nan Marie

Conference Paper Issue Date1995-03-27 View63
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