| 2000-03 | Adhesion of poly(4,4 '-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin | Yu, J; Ree, M; Shin, Tae Joo; Park, YH; Cai, W; Zhou, D; Lee, KW | ARTICLE | 714 |
| 2001-04 | FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne | Yu, Jinshu; Zhou, D; Cai, W; Park, SH; Shin, Tae Joo; Oh, W; Lee, SW; Ree, M | ARTICLE | 576 |
| 2000-01 | Miscibility behavior of polyimide (PI)/poly(arylene ether benzimidazole) (PAEBI) blends and its effects on the adhesion of PI/PAEBI/copper joints | Yu, J; Ree, M; Shin, Tae Joo; Wang, X; Cai, W; Zhou, D; Lee, KW | ARTICLE | 654 |
| 1999-10 | Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: Effect of precursor origin | Yu, J; Ree, M; Shin, TJ; Wang, X; Cai, W; Zhou, D; Lee, KW | ARTICLE | 118 |
| 2010-03-15 | Strong hot electron reflection from subsurface 8H-SiC inclusion in 4H-SiC: Ballistic Electron Emission Microscopy (BEEM) study | Park, Kibog; Cai, W; Pelz, JP; Miao, MS; Lambrecht, WRL; Zhang, X; Skowronski, M; Capano, MA | CONFERENCE | 36 |
