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Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View7
Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2017-08 View8
Nucleation-controlled growth of Cu thin films electrodeposited directly on ALD Ru diffusion barrier in additive-free electrolyte for Cu interconnect File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-04 View10
Origin of Screen-Printed Metal Contact Losses in Crystalline Silicon Solar Cells File

Jeong, Myeong Sang , Lee, Sang Hee , Choi, Sungjin , Min, Kwan Hong , Lee, Jong Hoon , Kang, Min Gu , Jeong, Kyung Taek , Kwak, Sang Kyu , Song, Hee-eun , Lee, Tae Kyung , et al

Article Issue Date2023-11 View6
Ru/WNx Bilayers as Diffusion Barriers for Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Choi, Sang-Hyeok , Kim, Soo-Hyun

Article Issue Date2011-05 View7
Synthesis of ZnO nanorods by the thermal reduction process of a mixture of ZnO and Al powder File

Nam, Kyung-Don , Kwak, Sang Kyu , Lee, Jong-Min

Article Issue Date2011-12 View7
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect File

Mun, Ki-Yeung , Hong, Tae Eun , Cheon, Taehoon , Jang, Yujin , Lim, Byoung-Yong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2014-07 View7
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