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- Kim, Gun-Ho
- SoftHeat Lab.
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C-MEMS 기반 디바이스의 패키징을 위한 탄소 박막이 집적된 Through Silicon Via 기술 개발
- Author(s)
- Kwak, Jong-Hyun, Kim, Beomsang, Kim, Shin-Kwan, Kim, Gun-Ho, Shin, Heungjoo
- Issued Date
- 2021-11-05
- Citation
- 2021년도 대한기계학회 추계학술대회
- Publisher
- 대한기계학회
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