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김건호

Kim, Gun-Ho
SoftHeat Lab.
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dc.citation.conferencePlace KO -
dc.citation.title 2021년도 대한기계학회 추계학술대회 -
dc.contributor.author Kwak, Jong-Hyun -
dc.contributor.author Kim, Beomsang -
dc.contributor.author Kim, Shin-Kwan -
dc.contributor.author Kim, Gun-Ho -
dc.contributor.author Shin, Heungjoo -
dc.date.accessioned 2024-01-31T21:08:54Z -
dc.date.available 2024-01-31T21:08:54Z -
dc.date.created 2021-12-30 -
dc.date.issued 2021-11-05 -
dc.identifier.bibliographicCitation 2021년도 대한기계학회 추계학술대회 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/76701 -
dc.publisher 대한기계학회 -
dc.title C-MEMS 기반 디바이스의 패키징을 위한 탄소 박막이 집적된 Through Silicon Via 기술 개발 -
dc.type Conference Paper -
dc.date.conferenceDate 2021-11-03 -

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