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An Approach to Assess Solder Interconnect Degradation Using Digital Signal
- Alternative Title
- An Approach to Assess Solder Interconnect Degradation Using Digital Signal
- Author(s)
- Yoon, Jeong-ah
- Advisor
- Kwon, Daeil
- Issued Date
- 2016-02
- URI
- https://scholarworks.unist.ac.kr/handle/201301/71971 http://unist.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000002236116
- Publisher
- Ulsan National Institute of Science and Technology
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