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Showing results 1 to 20 of 23

Issue DateTitleAuthor(s)TypeView
201701A DIGITAL TECHNIQUE FOR DIAGNOSING INTERCONNECT DEGRADATION BY USING DIGITAL SIGNAL CHARACTERISTICSLee, Jinwoo; Kwon, DaeilARTICLE260
201709A Dimensional Compensation Algorithm for Vertical Bending Deformation of 3D printed Parts in Selective Laser SinteringHa, Sangho; Ransikarbum, Kasin; Han, Hweeyoung; Kwon, Daeil; Kim, Hyeonnam; Kim, NamhunARTICLE131
201610A model-based prognostic approach to predict interconnect failure using impedance analysisKwon, Daeil; Yoon, JeongahARTICLE289
201804A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regressionLee, Changyong; Kwon, DaeilARTICLE7
201803Adaptive SVM-based Real-time Quality Assessment for Primer-Sealer Dispensing Process of Sunroof Assembly LineOh, YeongGwang; Ransikarbum, Kasin; Busogi, Moise; Kwon, Daeil; Kim, NamhunARTICLE10
2016-02An Approach to Assess Solder Interconnect Degradation Using Digital SignalKwon, Daeil; Yoon, Jeong-ahMaster's thesis466
201801Defect state and severity analysis using discretized state vectorsBaek, Soojung; Baek, Woonsang; Kwon, Daeil; Kim, Duck YoungARTICLE5
201601Detection of Failure Precursors in Multilayer Ceramic Capacitors Based on Symbolic Time Series AnalysisPark, Juyoung; Kwon, DaeilARTICLE311
2018-02Development of an On-chip Health Monitoring System for Solder Joints using Bit Error RatesKwon, Daeil; Shin, InsunMaster's thesis69
200906Early Detection of Interconnect Degradation by Continuous Monitoring of RF ImpedanceKwon, Daeil; Azarian, Michael H.; Pecht, MichaelARTICLE364
201802Early identification of emerging technologies: A machine learning approach using multiple patent indicatorsLee, Changyong; Kwon, Ohjin; Kim, Myeongjung; Kwon, DaeilARTICLE268
201709Effect of humidity changes on dimensional stability of 3D printed parts by selective laser sinteringKwon, Daeil; Park, Eunju; Ha, Sangho; Kim, NamhunARTICLE163
201309Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear ModelingKwon, Daeil; Azarian, Michael H.; Pecht, MichaelARTICLE363
201707Industry 4.0: A Special Section in IEEE AccessSu, Shun-Feng; Rudas, Imre J.; Zurada, Jacek M.; Er, Meng Joo; Chou, Jyh-Horng; Kwon, DaeilARTICLE82
201607IoT-Based Prognostics and Systems Health Management for Industrial ApplicationsKwon, Daeil; Hodkiewicz, Melinda; Fan, Jiajie; Shibutani, Tadahiro; Pecht, Michael G.ARTICLE327
201801Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian Tracking ApproachesShin, Insun; Kwon, DaeilARTICLE5
201105Nondestructive Sensing of Interconnect Failure Mechanisms Using Time-Domain ReflectometryKwon, Daeil; Azarian, Michael H.; Pecht, MichaelARTICLE362
201506Optimal Interval Censoring Design for Reliability Prediction of Electronic PackagesKwon, Daeil; Shin, InsunARTICLE372
201802PHM-based wiring system damage estimation for near zero downtime in manufacturing facilitiesLee, Jinwoo; Kwon, Daeil; Kim, Namhun; Lee, ChangyongARTICLE6
201009Prognostics of interconnect degradation using RF impedance monitoring and sequential probability ratio testKwon, Daeil; Azarian, M.H.; Pecht, M.ARTICLE503
Showing results 1 to 20 of 23

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