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Showing results 1 to 18 of 18

Issue DateTitleAuthor(s)TypeView
201701A DIGITAL TECHNIQUE FOR DIAGNOSING INTERCONNECT DEGRADATION BY USING DIGITAL SIGNAL CHARACTERISTICSLee, Jinwoo; Kwon, DaeilARTICLE219
1A Dimensional Compensation Algorithm for Vertical Bending Deformation of 3D printed Parts in Selective Laser SinteringHa, Sangho; Ransikarbum, Kasin; Han, Hweeyoung; Kwon, Daeil; Kim, Hyeonnam; Kim, NamhunARTICLE75
201610A model-based prognostic approach to predict interconnect failure using impedance analysisKwon, Daeil; Yoon, JeongahARTICLE261
2016-02An Approach to Assess Solder Interconnect Degradation Using Digital SignalKwon, Daeil; Yoon, Jeong-ahMaster's thesis390
201601Detection of Failure Precursors in Multilayer Ceramic Capacitors Based on Symbolic Time Series AnalysisPark, Juyoung; Kwon, DaeilARTICLE281
200906Early Detection of Interconnect Degradation by Continuous Monitoring of RF ImpedanceKwon, Daeil; Azarian, Michael H.; Pecht, MichaelARTICLE337
201802Early identification of emerging technologies: A machine learning approach using multiple patent indicatorsLee, Changyong; Kwon, Ohjin; Kim, Myeongjung; Kwon, DaeilARTICLE105
201709Effect of humidity changes on dimensional stability of 3D printed parts by selective laser sinteringKwon, Daeil; Park, Eunju; Ha, Sangho; Kim, NamhunARTICLE105
201309Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear ModelingKwon, Daeil; Azarian, Michael H.; Pecht, MichaelARTICLE317
201707Industry 4.0: A Special Section in IEEE AccessSu, Shun-Feng; Rudas, Imre J.; Zurada, Jacek M.; Er, Meng Joo; Chou, Jyh-Horng; Kwon, DaeilARTICLE59
201607IoT-Based Prognostics and Systems Health Management for Industrial ApplicationsKwon, Daeil; Hodkiewicz, Melinda; Fan, Jiajie; Shibutani, Tadahiro; Pecht, Michael G.ARTICLE295
201105Nondestructive Sensing of Interconnect Failure Mechanisms Using Time-Domain ReflectometryKwon, Daeil; Azarian, Michael H.; Pecht, MichaelARTICLE345
201506Optimal Interval Censoring Design for Reliability Prediction of Electronic PackagesKwon, Daeil; Shin, InsunARTICLE343
201009Prognostics of interconnect degradation using RF impedance monitoring and sequential probability ratio testKwon, Daeil; Azarian, M.H.; Pecht, M.ARTICLE464
201708Reliability Assessment of Low-Power Processors in Supercomputing Systems Shin, Insun; Kwon, DaeilARTICLE26
201511Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process RegressionKwon, Daeil; Azarian, Michael H; Pecht, MichaelARTICLE344
201606슈퍼컴퓨터에 사용되는 저전력 프로세서 패키지의 신뢰성 평가Park, Ju-Young; Kwon, Daeil; Nam, DukyunARTICLE228
2015-11저전력 프로세서 기반 슈퍼컴퓨터의 신뢰성 평가를 위한 선행연구Kwon, DaeilResearch Report370
Showing results 1 to 18 of 18

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