| 2020-03 | CMOS Backplane Pixel Circuit with Leakage and Voltage Compensation for an Micro-LED Display achieving 5,000 PPI or higher | Seong, Jewoo; Jang, Jinwoong; Lee, Jaehoon, et al | ARTICLE | 150 |
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| 2019-10 | RF Sensor-based Liveness Detection Scheme with Loop Stability Compensation Circuit for a Capacitive Fingerprint System | Kim, Woojoong; Hong, Woojin; Kim, Taekmoo, et al | ARTICLE | 114 |
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| 2018-05 | Controller Area Network with Flexible Data Rate Transmitter Design with Low Electromagnetic Emission | Kang, Sukhwan; Seong, Jewoo; Lee, Myunghee | ARTICLE | 271 |
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| 2018-03 | A Stepwise Split Power-Driving Scheme With Automatic Slope Control for EMC-Enhanced LIN Transceiver | Kim, Seungmok; Kim, Daewung; Lee, Kwangmuk, et al | ARTICLE | 551 |
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| 2018-01 | Transparent Fingerprint Sensor System for Large Flat Panel Display | Seo, Wonkuk; Pi, Jae-Eun; Cho, Sung Haeng, et al | ARTICLE | 447 |
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| 2010-02 | A reduced-voltage differential signaling (RVDS) interface for chip-on-glass TFT-LCD applications | Lim, Jung-Pil; Baek, Donghoon; Lee, Jae-Youl, et al | ARTICLE | 605 |
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| 2009-12 | A Piecewise Linear 10 Bit DAC Architecture With Drain Current Modulation for Compact LCD Driver ICs | Jeon, Yong-Joon; Lee, Hyung-Min; Lee, Sung-Woo, et al | ARTICLE | 539 |
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| 2009-03 | A 12-bit segmented resistor-capacitor digital-to-analog converter for a display driver IC of a large TFT-LCD panel system | Yoo, Seongjong; Song, Yongjoo; Jung, Jiwoon, et al | ARTICLE | 606 |
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| 2006-12 | A current-mode display driver IC using sample-and-hold scheme for QVGA full-color a MOLED displays | Baek, Jong Hak; Lee, Myunghee; Lee, Jae Hoon, et al | ARTICLE | 563 |
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| 2003-03 | 2.5 Gbit/s/channel laser driver design for four-channel parallel optic transceiver using SiGeBiCMOS technology | Kim, YG; Bien, Franklin; Chang, JJ, et al | ARTICLE | 891 |
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| 2002-11 | Four-channel parallel 3.125 Gbit/s/ch/s fibre optic receiver/transmitter chip signal detection circuit | Chang, JJ; Abrams, M; Kim, Y, et al | ARTICLE | 665 |
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| 1999-03 | A three-layer 3-D silicon system using through-Si vertical optical interconnections and SiCMOS hybrid building blocks | Bond, Steve W.; Vendier, Olivier; Lee, Myunghee, et al | ARTICLE | 444 |
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| 1997-02 | A 100 Mbps LED through-wafer optoelectronic link for multicomputer interconnection networks | May, Phil; Lee, Myunghee; Wilkinson, Scott T., et al | ARTICLE | 556 |
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| 1997-02 | Scaleable CMOS current-mode preamplifier design for an optical receiver | Lee, Myunghee; Vendier, O; Brooke, MA, et al | ARTICLE | 546 |
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| 1996-02 | Thin-film multimaterial optoelectronic integrated circuits | Jokerst, Nan Marie; Brooke, Martin A.; Vendier, Olivier, et al | ARTICLE | 510 |
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| 1995-06 | A 3-DIMENSIONAL HIGH-THROUGHPUT ARCHITECTURE USING THROUGH-WAFER OPTICAL INTERCONNECT | WILLS, D. Scott; Lacy, W. Stephen; Camperi-Ginestet, Christophe, et al | ARTICLE | 582 |
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