사진

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Kim, Ju-Young (김주영)

Department
Department of Materials Science and Engineering(신소재공학과)
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Issue DateTitleAuthor(s)TypeViewAltmetrics
2004-12나노압입자 첨단의 무딤을 고려한 압입크기효과 모델Kim, Ju-Young; Lee, Baegwoo; Kwon, DongilARTICLE597
2004-11Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide filmKim, Ju-Young; Lee, BW; Nam, HS, et alARTICLE601 Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide film
2004-03기상 증착된 비정질 실리콘 카바이드 박막질의 기판 온도 의존성Kim, Ju-Young; Lee, Baegwoo; Nam, Hoseok, et alARTICLE654
2004Molecular dynamics analysis of structure and intrinsic stress in amorphous silicon carbide film with deposition process parametersKim, Ju-Young; Lee, BW; Nam, HS, et alARTICLE597
2003-12Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometryLee, BW; Kim, Ju-Young; Kwon, DARTICLE599 Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry
2003-06레이저 간섭계(ESPI)에 의해 측정된 플립칩 열변형의 유한요소해석 모델링을 통한 솔더볼의 유동곡선 평가Lee, Baegwoo; Kim, Ju-Young; Nah, Jaewoong, et alARTICLE617
2003-04Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysisLee, BW; Jeong, JH; Jang, W, et alARTICLE698 Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis
2003나노압입시험을 이용한 마이크로/나노 소재의 물성 특성화 및 응용Kim, Ju-Young; Lee, Yun-Hee; Jang, Jaeil, et alARTICLE588

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