사진

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Kim, Ju-Young (김주영)

Department
School of Materials Science and Engineering(신소재공학부)
Research Interests
Flexible / stretchable devices, nano-mechanics, nanoporous metal, materials reliability
Lab
Robust Multifunctional Materials Lab
Website
http://www.jyklab.org/
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Issue DateTitleAuthor(s)TypeViewAltmetrics
2006-10나노압입 유기된 소성변형역 크기 측정에 기반한 박막소재의 항복강도 평가Lee, Yun-Hee; Kim, Ju-Young; Huh, Young-hak, et alARTICLE953
2006-07나노압흔의 3차원 형상분석을 통한 압입경도의 정밀측정Lee, Yun-Hee; Kim, Ju-Young; Kim, Yongil, et alARTICLE647
2006-06Mechanical characterization of nano-structured materials using nanoindentationKim, Ju-Young; Kim, SH; Lee, JS, et alARTICLE430
2006-03Optimum definition of true strain beneath a spherical indenter for deriving indentation flow curvesJeon, EC; Kim, Ju-Young; Baik, MK, et alARTICLE539 Optimum definition of true strain beneath a spherical indenter for deriving indentation flow curves
2006Feasible evaluation of flow properties and stress state of structural materials using instrumented indentation testsKim, Ju-Young; Lee, Jung-Suk; Lee, Kyung-Woo, et alARTICLE532
2006Yield property characterization for Au and TiN thin films by applying nanoindentation techniqueLee, Yun-Hee; Huh, Yong-Hak; Kim, Ju-Young, et alARTICLE480 Yield property characterization for Au and TiN thin films by applying nanoindentation technique
2005-12계장화압입시험법 (IIT: Instrumented Indentation Technique)의 소재 물성 분석 응용 및 표준화 연구Kwon, Dongil; Kim, Seonghun; Kim, Ju-Young, et alARTICLE792
2005-10Tensile properties and fatigue crack growth in LIGA nickel MEMS structuresSon, D; Kim, JJ; Kim, Ju-Young, et alARTICLE582 Tensile properties and fatigue crack growth in LIGA nickel MEMS structures
2005-08무딘 첨단의 Berkovich 압입자를 이용하는 나노압입시험에 의한 압입깊이의존 경도 특성화Kim, Ju-Young; Kim, Mincheol; Lee, Yun-Hee, et alARTICLE470
2005-03Influence of tip bluntness on the size-dependent nanoindentation hardnessKim, Ju-Young; Lee, BW; Read, DT, et alARTICLE510 Influence of tip bluntness on the size-dependent nanoindentation hardness
2004-12나노압입자 첨단의 무딤을 고려한 압입크기효과 모델Kim, Ju-Young; Lee, Baegwoo; Kwon, DongilARTICLE480
2004-11Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide filmKim, Ju-Young; Lee, BW; Nam, HS, et alARTICLE463 Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide film
2004-03기상 증착된 비정질 실리콘 카바이드 박막질의 기판 온도 의존성Kim, Ju-Young; Lee, Baegwoo; Nam, Hoseok, et alARTICLE540
2004Molecular dynamics analysis of structure and intrinsic stress in amorphous silicon carbide film with deposition process parametersKim, Ju-Young; Lee, BW; Nam, HS, et alARTICLE485
2003-12Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometryLee, BW; Kim, Ju-Young; Kwon, DARTICLE484 Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry
2003-06레이저 간섭계(ESPI)에 의해 측정된 플립칩 열변형의 유한요소해석 모델링을 통한 솔더볼의 유동곡선 평가Lee, Baegwoo; Kim, Ju-Young; Nah, Jaewoong, et alARTICLE535
2003-04Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysisLee, BW; Jeong, JH; Jang, W, et alARTICLE560 Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis
2003나노압입시험을 이용한 마이크로/나노 소재의 물성 특성화 및 응용Kim, Ju-Young; Lee, Yun-Hee; Jang, Jaeil, et alARTICLE481

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