2006-05 | Self-assembled monolayers on Pt(111): Molecular packing structure and strain effects observed by scanning tunneling microscopy | Lee, S; Park, J; Ragan, R, et al | ARTICLE | 638 |
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2006-02 | A comparison of the corrosion behavior of nanocrystalline and conventional Al 5083 samples | Kus, E; Lee, Zonghoon; Nutt, S, et al | ARTICLE | 753 |
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2006 | Core-shell structures and precipitation kinetics of Al3 (Sc, Zr) Li2 intermetallic phase in Al-rich alloy | Radmilovic. V; Tolley A.; Lee, Zonghoon, et al | ARTICLE | 721 |
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2005-11 | Bimodal microstructure and deformation of cryomilled bulk nanocrystalline Al-7.5Mg alloy | Lee, Zonghoon; Witkin, DB; Radmilovic, V, et al | ARTICLE | 677 |
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2005-09 | A tri-modal aluminum based composite with super-high strength | Ye, J; Han, BQ; Lee, Zonghoon, et al | ARTICLE | 652 |
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2005-06 | The influence of Sc on thermal stability of a nanocrystalline Al-Mg alloy processed by cryogenic ball milling | Zhou, F; Lee, Zonghoon; Lavernia, EJ, et al | ARTICLE | 635 |
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2005-04 | Deformation behavior of bimodal nanostructured 5083 Al alloys | Han, BQ; Lee, Zonghoon; Witkin, D, et al | ARTICLE | 755 |
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2004-08 | Microstructure and microhardness of cryomilled bulk nanocrystalline Al-7.5%Mg alloy consolidated by high pressure torsion | Lee, Zonghoon; Zhou, F; Valiev, RZ, et al | ARTICLE | 567 |
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2003-08 | Al-Mg alloy engineered with bimodal grain size for high strength and increased ductility | Witkin, D; Lee, Zonghoon; Rodriguez, R, et al | ARTICLE | 917 |
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2003-07 | Microstructural evolution and deformation of cryomilled nanocrystalline Al-Ti-Cu alloy | Lee, Zonghoon; Rodriguez, R; Hayes, RW, et al | ARTICLE | 615 |
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2003-03 | Mechanical properties of an ultrafine-grained Al-7.5 pct Mg alloy | Han, BQ; Lee, Zonghoon; Nutt, SR, et al | ARTICLE | 622 |
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1996-03 | Development of Duplexer Filters Using High Dielectric Constant Ceramic Resonators | Lee, Kyu Bok; Lee, Zonghoon; Kim, Kyung Bae, et al | ARTICLE | 684 |
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1992-06 | The Study on the Behavior of TiN Thin Film Growth According to Deposition Pressure in PECVD Process | Lee, Zonghoon; Nam, O.H.; Lee, I.W., et al | ARTICLE | 601 |
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