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Kim, Byungjo
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dc.citation.endPage 839 -
dc.citation.number 4 -
dc.citation.startPage 836 -
dc.citation.title IEEE ELECTRON DEVICE LETTERS -
dc.citation.volume 47 -
dc.contributor.author Gu, Hyeonho -
dc.contributor.author Jung, Haksoon -
dc.contributor.author Park, Minho -
dc.contributor.author Lee, Hyeonjin -
dc.contributor.author Choi, Ae Rim -
dc.contributor.author Oh, Il-Kwon -
dc.contributor.author Zhao, Yanfeng -
dc.contributor.author Kim, Byungjo -
dc.contributor.author Kim, Jungsik -
dc.contributor.author Jang, Byung Chul -
dc.contributor.author Lee, Yongwoo -
dc.contributor.author Kwon, Jimin -
dc.date.accessioned 2026-04-16T11:00:49Z -
dc.date.available 2026-04-16T11:00:49Z -
dc.date.created 2026-04-06 -
dc.date.issued 2026-04 -
dc.description.abstract 2T0C gain cell memory based on amorphous oxide semiconductor vertical channel transistors (VCTs) has emerged as a promising high-density embedded dynamic access memory solution for memory-centric computing systems, monolithically integrated atop silicon logic. This capacitor-less memory offers long retention time and a compact 4F(2) cell footprint, enabling low-power and area-efficient integration above logic circuits. In this work, amorphous indium tin oxide VCTs and 2T0C gain cells with hole diameters scaled down to 150 nm were fabricated. However, scaling the hole diameter caused residual etch by-products to accumulate along the channel sidewalls, degrading the subthreshold swing and on-state current. To mitigate this issue, a sidewall cleaning process was introduced to effectively remove the residues. The treatment improved the VCT on-state current by over three orders of magnitude and enabled stable single- and two-bit memory operation with retention time exceeding 160 s. -
dc.identifier.bibliographicCitation IEEE ELECTRON DEVICE LETTERS, v.47, no.4, pp.836 - 839 -
dc.identifier.doi 10.1109/LED.2026.3661249 -
dc.identifier.issn 0741-3106 -
dc.identifier.scopusid 2-s2.0-105029863773 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/91349 -
dc.identifier.wosid 001723817100031 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title Indium Tin Oxide Vertical Channel Transistors for Scaled 4F2 2T0C Gain Cell Memory With Etched Sidewall Cleaning -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Electrical & Electronic -
dc.relation.journalResearchArea Engineering -
dc.type.docType Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor embedded dynamic random-access memory (eDRAM) -
dc.subject.keywordAuthor monolithic three-dimensional (M3D) integration -
dc.subject.keywordAuthor Transistors -
dc.subject.keywordAuthor Logic gates -
dc.subject.keywordAuthor Tin -
dc.subject.keywordAuthor Indium tin oxide -
dc.subject.keywordAuthor Cleaning -
dc.subject.keywordAuthor Etching -
dc.subject.keywordAuthor Temperature measurement -
dc.subject.keywordAuthor DH-HEMTs -
dc.subject.keywordAuthor Byproduct -
dc.subject.keywordAuthor Titanium dioxide -
dc.subject.keywordAuthor Amorphous oxide semiconductors (AOSs) -
dc.subject.keywordAuthor indium tin oxide (ITO) -

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