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Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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DC Field Value Language
dc.citation.conferencePlace US -
dc.citation.title IEEE ICCE 2025 -
dc.contributor.author Park, Seongjin -
dc.contributor.author Kang, Dong Kwan -
dc.contributor.author Jeong, Hoon Eui -
dc.date.accessioned 2025-12-05T09:52:54Z -
dc.date.available 2025-12-05T09:52:54Z -
dc.date.created 2025-12-05 -
dc.date.issued 2025-01-11 -
dc.identifier.bibliographicCitation IEEE ICCE 2025 -
dc.identifier.doi 10.1109/ICCE63647.2025.10929860 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/88883 -
dc.publisher IEEE -
dc.title Microstructures-Metastructures Integrated Hybrid Adhesives for Wearable Sensors -
dc.type Conference Paper -
dc.date.conferenceDate 2025-01-11 -

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