File Download

  • Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
Related Researcher

정훈의

Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
Read More

Views & Downloads

Detailed Information

Cited time in webofscience Cited time in scopus
Metadata Downloads

Full metadata record

DC Field Value Language
dc.citation.startPage e01986 -
dc.citation.title Advanced Materials Technologies -
dc.contributor.author Park, Seongjin -
dc.contributor.author Kang, Dong Kwan -
dc.contributor.author Bae, Haejin -
dc.contributor.author Jung, Ho-Sup -
dc.contributor.author Jeong, Hoon Eui -
dc.date.accessioned 2025-12-03T10:41:34Z -
dc.date.available 2025-12-03T10:41:34Z -
dc.date.created 2025-12-02 -
dc.date.issued 2025-11 -
dc.description.abstract The development of smart adhesives capable of robust and reusable adhesion on rough surfaces remains challenging. Intimate microscale contact is essential for strong adhesion, but irregular topographies hinder conformal engagement and limit both adhesion strength and repeatability. Here, we introduce a surface-conformable hybrid adhesive integrating height-optimized hexagonal micropillars with nonlinear open cuts, coupling microscale adaptability with macroscale crack-guiding mechanics. Height optimization enhances rough-surface contact and adhesion, while engineered cuts guide and reverse interfacial cracks to provide direction-dependent detachment. This hybrid architecture achieves a pull-off strength of 79.5 kPa, peel energy of 106.3 N m−1, >100-cycle durability, and 20× directional contrast on substrates with RMS roughness of 20.1 µm. Integration into a robotic gripper confirms reliable grasp–release operation, highlighting potential applications in wearables, robotics, and biomedical devices -
dc.identifier.bibliographicCitation Advanced Materials Technologies, pp.e01986 -
dc.identifier.doi 10.1002/admt.202501986 -
dc.identifier.issn 2365-709X -
dc.identifier.scopusid 2-s2.0-105023279681 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/88821 -
dc.identifier.wosid 001627578200001 -
dc.language 영어 -
dc.publisher WILEY -
dc.title Micropillar-Engineered Hybrid Adhesive Patch for Surface-Conformable and Directional Adhesion -
dc.type Article -
dc.description.isOpenAccess TRUE -
dc.type.docType Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor crack controldry adhesivesgeckometamaterial adhesivessmart adhesives -
dc.subject.keywordPlus ASPECT-RATIO -

qrcode

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.