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우경석

Woo, Kyung Seok
Emerging Semiconductor Technology Laboratory
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DC Field Value Language
dc.citation.number 3 -
dc.citation.startPage 031323 -
dc.citation.title APPLIED PHYSICS REVIEWS -
dc.citation.volume 12 -
dc.contributor.author Woo, Kyung Seok -
dc.contributor.author Kim, Gwangmin -
dc.contributor.author Kim, Kyung Min -
dc.contributor.author Kumar, Suhas -
dc.date.accessioned 2025-09-18T12:00:02Z -
dc.date.available 2025-09-18T12:00:02Z -
dc.date.created 2025-09-16 -
dc.date.issued 2025-09 -
dc.description.abstract Managing heat is a major challenge in modern silicon-based computers due to both large static and dynamic power dissipations. There is a growing perspective that heat can serve as an information carrier (instead of being treated as a useless by-product) in post-silicon devices, enabling new functions and on-chip energy recycling. In this review, we introduce how heat can be utilized as a degree of freedom in electronic devices, and how such devices may enable efficient computers. -
dc.identifier.bibliographicCitation APPLIED PHYSICS REVIEWS, v.12, no.3, pp.031323 -
dc.identifier.doi 10.1063/5.0258988 -
dc.identifier.issn 1931-9401 -
dc.identifier.scopusid 2-s2.0-105015040467 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/88013 -
dc.identifier.wosid 001561998600001 -
dc.language 영어 -
dc.publisher AIP Publishing -
dc.title Role of heat in post-silicon electronics -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Physics, Applied -
dc.relation.journalResearchArea Physics -
dc.type.docType Review -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordPlus DYNAMICS -
dc.subject.keywordPlus NETWORKS -
dc.subject.keywordPlus RANDOM-ACCESS MEMORY -
dc.subject.keywordPlus FERROMAGNET -
dc.subject.keywordPlus POWER DISSIPATION -
dc.subject.keywordPlus MODEL -
dc.subject.keywordPlus PHASE-CHANGE MATERIALS -
dc.subject.keywordPlus MEMRISTOR -
dc.subject.keywordPlus COMPUTATION -

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