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- Kim, Ju-Young
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Reliability analysis of polymer-based copper redistribution layers (RDL) in advanced packaging technologies
- Author(s)
- Kwak. Ji-Youn, Cherry, Emmanuel, Bertheau, Julien, Slabbekoorn, John, Messemaeker, Joke De, Beyne, Eric, Kim, Ju-Young
- Issued Date
- 2024-11-07
- Citation
- 2024 ISMP
- Publisher
- ISMP
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