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- Kim, Ju-Young
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 2024 ISMP | - |
| dc.contributor.author | Sim, Youngju | - |
| dc.contributor.author | Hwang, Gyeong-Seok | - |
| dc.contributor.author | Kim, Ju-Young | - |
| dc.date.accessioned | 2024-12-19T14:05:09Z | - |
| dc.date.available | 2024-12-19T14:05:09Z | - |
| dc.date.created | 2024-12-17 | - |
| dc.date.issued | 2024-11-07 | - |
| dc.identifier.bibliographicCitation | 2024 ISMP | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/85018 | - |
| dc.publisher | ISMP | - |
| dc.title | Low-temperature hybrid bonding with photosensitive polymer insulation for advanced packaging | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2024-11-05 | - |
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