File Download
There are no files associated with this item.
SFX Link
- Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
- Kim, Ju-Young
Views & Downloads
Detailed Information
Cited time in 
Cited time in 
Cited time in
Metadata Downloads
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 제31회 한국반도체학술대회 | - |
| dc.contributor.author | Kim, Ju-Young | - |
| dc.contributor.author | 곽지윤 | - |
| dc.contributor.author | 심영주 | - |
| dc.date.accessioned | 2024-12-17T13:35:08Z | - |
| dc.date.available | 2024-12-17T13:35:08Z | - |
| dc.date.created | 2024-12-17 | - |
| dc.date.issued | 2024-01-25 | - |
| dc.identifier.bibliographicCitation | 제31회 한국반도체학술대회 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/84958 | - |
| dc.publisher | 한국반도체학회 | - |
| dc.title | Low Temperature Cu-Cu Direct Bonding: A Key Technology in Advanced Semiconductor Packaging Technology | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2024-01-24 | - |
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.