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Molecularly engineered copolyimide film for capacitive humidity sensor

Author(s)
Kim, Il JinLee, Ji EunKo, Jae WangJung, JiyoonLee, Albert S.Lee, Dong JinLee, Seung GeolPark, Bo-InYu, SeunggunLee, Jin Hong
Issued Date
2020-06
DOI
10.1016/j.matlet.2020.127565
URI
https://scholarworks.unist.ac.kr/handle/201301/81716
Citation
MATERIALS LETTERS, v.268, pp.127565
Abstract
We present a capacitive humidity sensor with molecularly engineered polyimide (PI) sensing layer. Molecularly engineered PIs were successfully prepared by synthesizing polyamic acids (PAAs) through blending of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) with 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6-FDA) as monomer, followed by thermal imidization, respectively. The molecularly engineered PIs exhibited high thermal stability as well as controllable water uptake properties. Capacitive performances of the humidity sensor with PIs were efficiently increased via simple molecular blending. (C) 2020 Elsevier B.V. All rights reserved.
Publisher
ELSEVIER
ISSN
0167-577X
Keyword (Author)
PolyimideCapacitanceHysteresisHumidity sensor

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