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신흥주

Shin, Heungjoo
Micro/Nano Integrated Systems Lab.
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dc.citation.conferencePlace US -
dc.citation.conferencePlace San Francisco, CA -
dc.citation.endPage 555 -
dc.citation.startPage 554 -
dc.citation.title IEEE International Solid-State Circuits Conference -
dc.contributor.author Cho, Jeonghoon -
dc.contributor.author Pyeon, You Jang -
dc.contributor.author Yeom, Junyeong -
dc.contributor.author Kim, Hyunjoong -
dc.contributor.author Cho, Sanghyeon -
dc.contributor.author Kim, Yonggi -
dc.contributor.author Kim, Taejung -
dc.contributor.author Kwak, Jong-Hyun -
dc.contributor.author Choi, Gunjun -
dc.contributor.author Lee, Yun-Sik -
dc.contributor.author Shin, Heungjoo -
dc.contributor.author Jeong, Hoon Eui -
dc.contributor.author Kim, Jae Joon -
dc.date.accessioned 2024-03-12T15:35:08Z -
dc.date.available 2024-03-12T15:35:08Z -
dc.date.created 2024-03-08 -
dc.date.issued 2024-02-21 -
dc.identifier.bibliographicCitation IEEE International Solid-State Circuits Conference, pp.554 - 555 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/81562 -
dc.language 영어 -
dc.publisher IEEE -
dc.title An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction -
dc.type Conference Paper -
dc.date.conferenceDate 2024-02-18 -

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