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Jeong, Changwook
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dc.citation.conferencePlace US -
dc.citation.conferencePlace Portland, OR -
dc.citation.title 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) -
dc.contributor.author Min, Jeong Guk -
dc.contributor.author Jeong, Changwook -
dc.contributor.author Kwon, Uihui -
dc.contributor.author Kim, Dae Sin -
dc.contributor.author Kim, Suhyun -
dc.contributor.author Kim, Ilryoung -
dc.contributor.author Yang, Joon-Sung -
dc.date.accessioned 2024-02-01T01:10:50Z -
dc.date.available 2024-02-01T01:10:50Z -
dc.date.created 2022-04-11 -
dc.date.issued 2018-10-14 -
dc.description.abstract The optimal position of dislocation stress memorization technique (DSMT) to maximize n-FinFET performance as well as the stacking fault (SF) number, [Ge] concentration limit and p-FinFET DC tradeoff in eSiGe are newly investigated by using the scanning moiré fringe (SMF) and scanning transmission electron microscopy-geometrical phase analysis (STEM-GPA) validated in-house 3D TCAD model in various bulk finFET structures. -
dc.identifier.bibliographicCitation 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) -
dc.identifier.doi 10.1109/nmdc.2018.8605736 -
dc.identifier.scopusid 2-s2.0-85061784248 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/80787 -
dc.publisher IEEE -
dc.title The Impact of Dislocation on Bulk -Si FinFET Technologies: Physical Modeling of Strain Relaxation and Enhancement by Dislocation -
dc.type Conference Paper -
dc.date.conferenceDate 2018-10-14 -

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