dc.citation.endPage |
859 |
- |
dc.citation.number |
6 |
- |
dc.citation.startPage |
846 |
- |
dc.citation.title |
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS ANDSYSTEMS |
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dc.citation.volume |
28 |
- |
dc.contributor.author |
Han, Ki Jin |
- |
dc.contributor.author |
Swaminathan, Madhavan |
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dc.date.accessioned |
2023-12-22T08:06:18Z |
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dc.date.available |
2023-12-22T08:06:18Z |
- |
dc.date.created |
2014-10-30 |
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dc.date.issued |
2009-06 |
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dc.description.abstract |
For the successful electrical design of system-inpackage, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips. |
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dc.identifier.bibliographicCitation |
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS ANDSYSTEMS, v.28, no.6, pp.846 - 859 |
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dc.identifier.doi |
10.1109/TCAD.2009.2016642 |
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dc.identifier.issn |
0278-0070 |
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dc.identifier.scopusid |
2-s2.0-77955189642 |
- |
dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/8067 |
- |
dc.identifier.url |
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=77955189642 |
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dc.identifier.wosid |
000266332200007 |
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dc.language |
영어 |
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dc.publisher |
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
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dc.title |
Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions |
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dc.type |
Article |
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dc.description.journalRegisteredClass |
scopus |
- |