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김진국

Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Lab.
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dc.citation.endPage 64 -
dc.citation.number 2 -
dc.citation.startPage 62 -
dc.citation.title IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS -
dc.citation.volume 21 -
dc.contributor.author Kim, Jingook -
dc.contributor.author Shringarpure, Ketan -
dc.contributor.author Fan, Jun -
dc.contributor.author Kim, Joungho -
dc.contributor.author Drewniak, James L. -
dc.date.accessioned 2023-12-22T06:36:28Z -
dc.date.available 2023-12-22T06:36:28Z -
dc.date.created 2014-10-29 -
dc.date.issued 2011-02 -
dc.description.abstract An equivalent circuit model for multilayer power planes with multiple via arrays is proposed. The complexity of the actual geometry is greatly reduced in the circuit model with the accuracy maintained. The model is corroborated by measurements. -
dc.identifier.bibliographicCitation IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64 -
dc.identifier.doi 10.1109/LMWC.2010.2100079 -
dc.identifier.issn 1531-1309 -
dc.identifier.scopusid 2-s2.0-79951654394 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/7967 -
dc.identifier.url http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=79951654394 -
dc.identifier.wosid 000287319900002 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title Equivalent circuit model for power bus design in multi-layer PCBs with via arrays -
dc.type Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -

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