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Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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DC Field Value Language
dc.citation.conferencePlace KO -
dc.citation.title PRESM2022 -
dc.contributor.author Kwon, Hyukjoo -
dc.contributor.author Lee, Donghyuk -
dc.contributor.author Seong, Minho -
dc.contributor.author Park, Seongjin -
dc.contributor.author Choi, Geonjun -
dc.contributor.author Jang, Hyejin -
dc.contributor.author Kim, Jaeil -
dc.contributor.author Sun, Kahyun -
dc.contributor.author Murugesan, Balaji -
dc.contributor.author Jeong, Hoon Eui -
dc.date.accessioned 2024-01-31T20:08:12Z -
dc.date.available 2024-01-31T20:08:12Z -
dc.date.created 2023-01-03 -
dc.date.issued 2022-07-21 -
dc.identifier.bibliographicCitation PRESM2022 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/75665 -
dc.language 영어 -
dc.publisher Korean Society for Precision Engineering (KSPE) -
dc.title Enhanced Thermal Transport in a Flexible Thermal Device by a Self-Interfacing Characteristic -
dc.type Conference Paper -
dc.date.conferenceDate 2022-07-20 -

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