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Byun, Gangil
Antenna Technology Lab.
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dc.citation.conferencePlace KO -
dc.citation.title 2023년도 한국전자파학회 하계종합학술대회 -
dc.contributor.author Kim, Haneul -
dc.contributor.author Kim, Sang Eun -
dc.contributor.author 차광형 -
dc.contributor.author Byun, Gangil -
dc.date.accessioned 2024-01-31T18:36:22Z -
dc.date.available 2024-01-31T18:36:22Z -
dc.date.created 2023-12-17 -
dc.date.issued 2023-08-25 -
dc.identifier.bibliographicCitation 2023년도 한국전자파학회 하계종합학술대회 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/74581 -
dc.publisher 한국전자파학회 -
dc.title Through Via를 활용한 PCB Litz 패턴 코일 설계 연구 -
dc.type Conference Paper -
dc.date.conferenceDate 2023-08-23 -

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