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Jeong, Hoon Eui
Multiscale Biomimetics & Manufacturing Lab
Research Interests
  • Biomimetics
  • Multiscale manufacturing
  • Micro/nanofabrication

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Wettability of nanoengineered dual-roughness surfaces fabricated by UV-assisted capillary force lithography

DC Field Value Language
dc.contributor.author Jeong, Hoon Eui ko
dc.contributor.author Kwak, Moon Kyu ko
dc.contributor.author Park, Chan Ick ko
dc.contributor.author Suh, Kahp Yang ko
dc.date.available 2014-10-17T08:39:17Z -
dc.date.created 2014-10-17 ko
dc.date.issued 2009-11 -
dc.identifier.citation JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.339, no.1, pp.202 - 207 ko
dc.identifier.issn 0021-9797 ko
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/7378 -
dc.identifier.uri https://linkinghub.elsevier.com/retrieve/pii/S0021979709009084 ko
dc.description.abstract Micro- and nanoscale combined hierarchical polymer structures were fabricated by UV-assisted capillary force lithography. The method is based on the sequential application of engraved polymer molds with a UV-curable resin of polyurethane acrylate (PUA) followed by surface treatment with a trichloro(1H,1H,2H,2H-perfluorooctyl) silane in vapor phase. Two distinct wetting states were observed on these dual-roughness structures. One is "Cassie-Wenzel state" where a water droplet forms heterogeneous contact with microstructures and homogeneous contact with nanostructures. The other is "Cassie-Cassie state" where a droplet makes heterogeneous contact both with micro- and nanostructures. A simple thermodynamic model was developed to explain static contact angle, hysteresis, and wetting transition on dual-roughness structures. ko
dc.description.statementofresponsibility close -
dc.language ENG ko
dc.publisher ACADEMIC PRESS INC ELSEVIER SCIENCE ko
dc.subject Dual roughness ko
dc.subject Hierarchical structure ko
dc.subject Lithography ko
dc.subject Wettability ko
dc.title Wettability of nanoengineered dual-roughness surfaces fabricated by UV-assisted capillary force lithography ko
dc.type ARTICLE ko
dc.identifier.scopusid 2-s2.0-69249202237 ko
dc.identifier.wosid 000272262900025 ko
dc.type.rims ART ko
dc.description.wostc 45 *
dc.description.scopustc 48 *
dc.date.tcdate 2015-05-06 *
dc.date.scptcdate 2014-10-17 *
dc.identifier.doi 10.1016/j.jcis.2009.07.020 ko
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