File Download

There are no files associated with this item.

  • Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
Related Researcher

김성엽

Kim, Sung Youb
Computational Advanced Nanomechanics Lab.
Read More

Views & Downloads

Detailed Information

Cited time in webofscience Cited time in scopus
Metadata Downloads

Full metadata record

DC Field Value Language
dc.citation.endPage 286 -
dc.citation.number 3-4 -
dc.citation.startPage 273 -
dc.citation.title INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING -
dc.citation.volume 5 -
dc.contributor.author Kim, Sung Youb -
dc.contributor.author Lee, In-Ho -
dc.contributor.author Jun, Sukky -
dc.date.accessioned 2023-12-22T09:15:38Z -
dc.date.available 2023-12-22T09:15:38Z -
dc.date.created 2014-10-16 -
dc.date.issued 2007-05 -
dc.description.abstract Action-derived molecular dynamics is applied to the simulation of self-diffusion processes on copper substrates. By minimizing a modified action with an energy conservation constraint, the method enables effective computations of minimum energy paths and activation energy barriers for the broad range of multiple timescale problems, including infrequent events and slow-mode systems. Single-adatom diffusions of hopping and exchange moves are first presented to demonstrate its performance. More complex diffusion mechanisms are simulated for hopping and exchange motions across a double-layer step on the Cu(111) surface, which are very difficult to explore by conventional molecular dynamics. Strain effects on diffusion energy barriers are also investigated for a Cu(001)flat surface. Finally, we propose an algorithm to incorporate a multiple length scale scheme into the current method, i.e., the combination of the action-derived molecular dynamics with the nonlocal quasicontinuum method. This hybrid scheme is expected to provide an efficient route to the simultaneous coupling of multiple length and timescales within a single algorithmic framework. -
dc.identifier.bibliographicCitation INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING, v.5, no.3-4, pp.273 - 286 -
dc.identifier.doi 10.1615/IntJMultCompEng.v5.i3-4.90 -
dc.identifier.issn 1543-1649 -
dc.identifier.scopusid 2-s2.0-38049173148 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/7318 -
dc.identifier.url http://www.dl.begellhouse.com/journals/61fd1b191cf7e96f,3cf3b25417fa966d,6e371e1c1b965e4b.html -
dc.identifier.wosid 000250973700009 -
dc.language 영어 -
dc.publisher BEGELL HOUSE INC -
dc.title Action-based pathway Modeling for atomic surface diffusion -
dc.type Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordPlus MOLECULAR-DYNAMICS -
dc.subject.keywordPlus CLASSICAL TRAJECTORIES -
dc.subject.keywordPlus SELF-DIFFUSION -
dc.subject.keywordPlus TIME-SCALE -
dc.subject.keywordPlus STEP -
dc.subject.keywordPlus SIMULATION -
dc.subject.keywordPlus TRANSFORMATIONS -
dc.subject.keywordPlus METALS -
dc.subject.keywordPlus ALLOYS -

qrcode

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.