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Son, Jae Sung
Nanomaterials Science and Engineering Lab (NSE)
Research Interests
  • Nanoparticle, 3D printing, Thermoelectrics, Electronics


All-Inorganic Nanocrystals as a Glue for BiSbTe Grains: Design of Interfaces in Mesostructured Thermoelectric Materials

DC Field Value Language Son, Jae Sung ko Zhang, Hao ko Jang, Jaeyoung ko Poudel, Bed ko Waring, Al ko Nally, Luke ko Talapin, Dmitri V. ko 2014-10-16T01:53:18Z - 2014-10-15 ko 2014-07 -
dc.identifier.citation ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.53, no.29, pp.7466 - 7470 ko
dc.identifier.issn 1433-7851 ko
dc.identifier.uri -
dc.description.abstract Nano- and mesostructuring is widely used in thermoelectric (TE) materials. It introduces numerous interfaces and grain boundaries that scatter phonons and decrease thermal conductivity. A new approach has been developed for the rational design of the interfaces in TE materials by using all-inorganic nanocrystals (NCs) that serve as a "glue" for mesoscopic grains. For example, circa 10 nm Bi NCs capped with (N2H5)(4)Sb2Te7 chalcogenidometallate ligands can be used as an additive to BiSbTe particles. During heat treatment, NCs fill up the voids between particles and act as a "glue", joining grains in hot-pressed pellets or solution-processed films. The chemical design of NC glue allowed the selective enhancement or decrease of the majority-carrier concentration near the grain boundaries, and thus resulted in doped or de-doped interfaces in granular TE material. Chemically engineered interfaces can be used as to optimize power factor and thermal conductivity. ko
dc.description.statementofresponsibility close -
dc.language ENG ko
dc.publisher WILEY-V C H VERLAG GMBH ko
dc.subject bismuth ko
dc.subject interfaces ko
dc.subject nanostructures ko
dc.subject semiconductors ko
dc.subject thermoelectric materials ko
dc.title All-Inorganic Nanocrystals as a Glue for BiSbTe Grains: Design of Interfaces in Mesostructured Thermoelectric Materials ko
dc.type ARTICLE ko
dc.identifier.scopusid 2-s2.0-84904430239 ko
dc.identifier.wosid 000339564800007 ko
dc.type.rims ART ko
dc.description.wostc 2 * 2015-05-06 *
dc.identifier.doi 10.1002/anie.201402026 ko
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