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- Kim, BongSoo
- Polymer & Organic Semiconductor Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.assignee | 울산과학기술원 | - |
| dc.contributor.author | 이명재 | - |
| dc.contributor.author | 김봉수 | - |
| dc.date.accessioned | 2024-01-23T17:39:51Z | - |
| dc.date.application | 2020-12-18 | - |
| dc.date.available | 2024-01-23T17:39:51Z | - |
| dc.date.registration | 2023-03-07 | - |
| dc.identifier.patentApplicationNumber | 10-2020-0178860 | - |
| dc.identifier.patentRegistrationNumber | 10-2509099 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/69180 | - |
| dc.title | 3차원 가교제용 조성물 및 이를 이용한 전자 소자 제조 방법 | - |
| dc.type | Patent | - |
| dc.publisher.country | KO | - |
| dc.type.iprs | 특허 | - |
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