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정훈의

Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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dc.contributor.assignee 울산과학기술원 / 국립생태원 -
dc.contributor.author 정훈의 -
dc.contributor.author 최건준 -
dc.contributor.author 박성진 -
dc.contributor.author 박채빈 -
dc.contributor.author 김진희 -
dc.contributor.author 이상현 -
dc.contributor.author 배해진 -
dc.contributor.author 김지영 -
dc.contributor.author 성민호 -
dc.date.accessioned 2024-01-23T17:10:01Z -
dc.date.application 2022-05-10 -
dc.date.available 2024-01-23T17:10:01Z -
dc.date.registration 2023-12-12 -
dc.identifier.patentApplicationNumber 10-2022-0057118 -
dc.identifier.patentRegistrationNumber 10-2614237 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/68625 -
dc.title 습윤 접착 패치 및 이의 제조방법 -
dc.type Patent -
dc.publisher.country KO -
dc.type.iprs 특허 -

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